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PCB HDI
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HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity

HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity

Brand Name: Customized
MOQ: 1 panel
harga: Dapat dinegosiasikan
Payment Terms: T/T
Detail Information
Place of Origin:
China
Sertifikasi:
ISO9001,ISO13485, TS16949
Jenis Produk:
6 Lapisan Hdi PCB
Bahan Dasar:
FR4/ROGERS/Aluminium/TG Tinggi/TG Tengah
Jembatan Topeng Solder Minimum:
0,08mm
Ketebalan cu:
1oz
Pengujian:
tes AOI
Topeng Solder:
Topeng Solder Hitam
Kontrol Impedansi:
± 10%
teknologi:
Lubang kubur dan lubang buta, sumbat resin
Kemasan rincian:
Paket Vakum
Menyoroti:

HDI PCB with 1OZ copper

,

high-density interconnect PCB

,

HDI circuit board superior conductivity

Deskripsi Produk

Product Description:

 

About Blind hole and burid hole

When PCB space is constrained or plated through-hole design is limited, blind and buried vias can provide an effective solution.

Blind and buried via technology has been crucial for packing greater functionality into compact layouts. By shortening vias so they only traverse the necessary layers, more surface area is freed up for component placement.

These vias are employed to connect PCB layers where space is highly limited. A blind via links an outer layer to one or more inner layers without passing through the entire board. A buried via, on the other hand, connects two or more inner layers and does not reach any outer layer.

Key advantages include:

  • Meeting density requirements for traces and pads without adding layers or enlarging board size
  • Reducing the PCB aspect ratio

A blind via is a copper-plated hole that connects exactly one outer layer to one or more inner layers and does not penetrate the entire board. In design terms, blind vias are specified in a separate drill file.HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity 0