products details

Rumah Produk

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

Brand Name:	Customized
MOQ:	1 panel
harga:	Dapat dinegosiasikan
Payment Terms:	T/T

Detail Information

Deskripsi Produk

Detail Information

Place of Origin:

China

Sertifikasi:

ISO9001, ISO13485,IS014001

Jenis papan:

6 lapisan

Bahan Dasar:

FR4/ROGERS/Tg Tinggi

Topeng Solder:

Topeng Solder Hijau

Jembatan Topeng Solder Minimum:

0,1 mm

Permukaan Selesai:

EING

Jenis Layanan:

Prototipe PCB/ Produksi Massal

Ukuran:

Disesuaikan

Ketebalan cu:

1oz

Ukuran substrat maksimum:

24 "x32"

Kemasan rincian:

Paket Vakum

Menyoroti:

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Deskripsi Produk

Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict, but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

Circuit width and spacing limits
Annular ring and aspect ratio limits, especially for high reliability designs and requirements
Material choice used in the board to ensure impedance control in the required stackup
Impedance profiles for the desired stackup or layer pairs if available
Blind vias connect exterior layer to at least one interior layer without penetrating the entire board.
Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type 0

Tag:

Papan PCB yang fleksibel

PCB kaku

PCB tembaga

PCB Fleksibel Kaku

Papan PCB Aluminium

PCB HDI

PCB Tembaga Berat

Roger pcb

Papan PCB LED

Majelis PCB Daya

Penggulungan PCB

Putar Cepat PCB

PCB Frekuensi Tinggi

Majelis PCB EMS

Papan PCB yang fleksibel

PCB kaku

PCB tembaga

PCB Fleksibel Kaku

Papan PCB Aluminium

PCB HDI

PCB Tembaga Berat

Roger pcb

Papan PCB LED

Majelis PCB Daya

Penggulungan PCB

Putar Cepat PCB

PCB Frekuensi Tinggi

Majelis PCB EMS

products details

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Product Description:

HDI PCB Design DFM Requirements